Soldering machine VI TECHNOLOGY PI PRIMO

Manufacturer: Vi Technology

Year of Manufacture: 2021

Model: PI PRIMO

Type of Machine: Solder Paste Inspection (SPI) System

Technical Specifications:

- Configuration: Single

- 3D Vision: 80 Mpixel 3D system (32 cameras, 8 projectors)

- Triangulation: Distortion free 3D triangulation system

- Lighting: High power RGB LED lighting for 3D color image

- Resolution: 15 micron

- Max Paste Height Measurement: 400 micron

- Max PCB Size: 533 x 533 mm

- Min PCB Size: 50 x 50 mm

- PCB Thickness Range: 0.1 to 5 mm

- Edge Clearance: 3 mm

- Max PCB Warp: plus or minus 5 mm

- Calibration: Embedded photometric and geometric calibration tools

- Standard Conveyor Length: 1000 mm (800 mm option)

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